About us
REACH BEYOND THE STARS RISE WITH THE NATION
Nova Stella (Shenzhen) Technology Co., Ltd., established in January 2025, is a high-tech enterprise focused on core communications in the commercial aerospace sector. We are dedicated to the R&D, production, and sales of phased array antennas, laser communication terminals, and space optical cameras, and promote the upgraded development of commercial aerospace communications, remote sensing and other fields with innovative technologies.
The company brings together industry elites from top institutions including the Chinese Academy of Sciences (CAS), China Aerospace Science and Technology Corporation (CASC), University of Science and Technology of China (USTC), Beijing Institute of Technology (BIT), and Harbin Institute of Technology (HIT). With over 70 employees, more than 80% hold Master's or Doctoral degrees. Our core team possesses more than 30 years of technical accumulation in phased array antennas, laser communications, and space optical camera payloads, equipped with full-chain technical and service capabilities for comprehensive communication solutions from design to productization.
30 year
50 +
24 h
70 +
Core technology
核心技术
专业团队
资深专利代理人、商标代理人、律师、知识产权分析师等组成的专业团队，
团队成员均具备扎实的专业知识和丰富的实践经验。
Design
Technology
封装技术
芯片封装不仅保护芯片，还实现电气连接和散热。从传统的引线键合
封装到先进的倒装芯片、晶圆级封装、2.5D/3D 封装等，封装技术不断演进。
Manufacturing
Technology
制造技术
制程工艺是芯片制造的核心，通过光刻、蚀刻、沉积等工艺，
在硅片上构建纳米级的晶体管和电路。
制造技术
硅是芯片制造的主要材料，但近年来，为满足更高性能需求，
新型材料不断涌现，如碳化硅（SiC）、氮化镓（GaN）等宽禁带半导体材料。
高效能源管理系统
Efficient energy management system
智能驾驶辅助功能
Intelligent driver assistance system
轻量化车身设计
Lightweight body design
About us
REACH BEYOND THE STARS RISE WITH THE NATION
Nova Stella (Shenzhen) Technology Co., Ltd., established in January 2025, is a high-tech enterprise focused on core communications in the commercial aerospace sector. We are dedicated to the R&D, production, and sales of phased array antennas, laser communication terminals, and space optical cameras, and promote the upgraded development of commercial aerospace communications, remote sensing and other fields with innovative technologies.
The company brings together industry elites from top institutions including the Chinese Academy of Sciences (CAS), China Aerospace Science and Technology Corporation (CASC), University of Science and Technology of China (USTC), Beijing Institute of Technology (BIT), and Harbin Institute of Technology (HIT). With over 70 employees, more than 80% hold Master's or Doctoral degrees.Our core team possesses more than 30 years of technical accumulation in phased array antennas, laser communications, and space optical camera payloads, equipped with full-chain technical and service capabilities for comprehensive communication solutions from design to productization.
30 Years
Technical Precipitation
50 +
Core Technology
24 h
Rapid Response
70 +
Top Talent
Core technology
核心技术
设计技术
集成电路设计是芯片研发的基础，涵盖系统架构设计、逻辑设计、电路设计等。借助电子设计自动化（EDA）工具，将复杂的功能需求转化为芯片版图。
Design
Technology
封装技术
芯片封装不仅保护芯片，还实现电气连接和散热。从传统的引线键合封装到先进的倒装芯片、晶圆级封装、2.5D/3D 封装等，封装技术不断演进。
Manufacturing
Technology
制造技术
制程工艺是芯片制造的核心，通过光刻、蚀刻、沉积等工艺，在硅片上构建纳米级的晶体管和电路。
材料技术
硅是芯片制造的主要材料，但近年来，为满足更高性能需求，新型材料不断涌现，如碳化硅（SiC）、氮化镓（GaN）等宽禁带半导体材料。
Nova Stella
We develop world-class commercial aerospace communication solutions, empowering China's commercial aerospace industry to scale new heights.
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MAIL：
liangjianxingtong@vip.163.com
Address：Room 510, Saixi Technology Building, 3398 Binhai Avenue, Binhai Community, Yuehai Street, Nanshan District, Shenzhen,China
Nova Stella
Email: liangjianxingtong@vip.163.com
Address：Room 510, Saixi Technology Building, 3398 Binhai Avenue, Binhai Community, Yuehai Street, Nanshan District, Shenzhen, China
Copyright ©2023 All Rights Reserved xxxx有限公司 版权所有| 粤ICP备00000000号
